doc. no : qw0905-la16b/y-4 rev : a date : 12 - jul - 2005 led array data sheet la16b/y-4 ligitek electronics co.,ltd. property of ligitek only
ligitek electronics co.,ltd. property of ligitek only part no. la16b/y-4 note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 3.3 4.3 1.0min 25.0min 2.54typ 0.5 typ 1.5max 7.4 5.08 3.5 - 4.0 2.9 3.1 ly2640-1 ?? 0.5 typ 2.54typ + - 4.75 ? 0.5 2.0 ? 0.5 r 3.5 4.6 package dimensions 6.5 page 1/4
page 2/4 ligitek electronics co.,ltd. property of ligitek only note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. yellow diffused lens color typical electrical & optical characteristics (ta=25 j ) material part no la16b/y-4 yellow emitted gaasp/gap luminous intensity @10ma(mcd) viewing angle 2 c 1/2 (deg) spectral halfwidth ??f nm peak wave length f pnm forward voltage @20ma(v) 1.7 min. 585 35 typ. min. max. 2.6 8.0 12 50 pd tstg t opr tsol soldering temperature power dissipation reverse current @5v storage temperature operating temperature ir max 260 j for 5 sec max (2mm from body) -40 ~ +100 -40 ~ +85 10 60 j j g a mw absolute maximum ratings at ta=25 j i fp symbol forward current peak forward current duty 1/10@10khz parameter i f part no. la16b/y-4 ratings 80 20 y ma ma unit
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 700 y chip page 3/4 part no. la16b/y-4
ligitek electronics co.,ltd. property of ligitek only mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 jis c 7021: b-12 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec solderability test this test intended to see soldering well performed or not. the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. high temperature storage test 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. high temperature high humidity test solder resistance test thermal shock test low temperature storage test the purpose of this test is the resistance of the device under tropical for hous. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) reliability test: operating life test test item part no. la16b/y-4 this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. test condition description reference standard page 4/4
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